R5F564MLGDLC#21 Automotive SoC This industrial-grade device delivers 166MHz

This industrial-grade device delivers 166MHz processing speed with comprehensive connectivity including Ethernet

Compact Package: 1020-FCPBGA (33x33mm) surface mount design for space-efficient layouts

Product attributes Property Value Manufacturer Lattice Semiconductor Corporation Product Series LA-ECP5 Packaging Tray | Tray Number of LABs/CLBs 5500 Number of Logic Elements/Cells 44000 Total RAM Bits 1990656 Number of I/O 203 Number of Gates - Voltage - Supply 1

Industrial Grade: Operating temperature range of 0°C to 85°C (TJ) for reliable performance

Active production status with long lifecycle commitment

R5F564MLGDLC#21 Automotive SoC This industrial-grade device delivers 166MHzProduct attributes Property Value Manufacturer Renesas Electronics Corporation Product Series RX600 Packaging Tray Core Processor RXv2 Core Size 32 Bit Single Core Speed 120MHz Connectivity CANbus, EBI EMI, Ethernet, I2C, LINbus, MMC SD, SCI, SPI, SSI, UART USART, USB Peripherals DMA, LVD, POR, PWM, WDT Number of I O 127 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size 64K x 8 RAM Size 552K x 8 Voltage Supply (Vcc Vdd) 2. 7V ~ 3.